ZMR5830 Hot Air BGA Rework Station 3-Zone Heater Motherboard Chip Repair Station

Description

Z
M-R5830 Hot Air BGA Rework Station 3-Zones Heater Motherboard Chip Repair Station
NEW
Description:
1. Adopt liner slide which makes X Y Z axis all can do precision adjustment or fast positioning, with high positioning accuracy  and fast maneuverability.
2. high definition touch screen , PCL control, can save multiple groups profile, password protection and modify function, and can save multiple groups profile, equipped with instant temperature curve analysis function.
3. There are 3 independent heating areas from top to bottom. The 1st and 2nd are hot-air heaters, the 3rd is IR preheating, temperature controlled within ±1℃. Top heater can be adjusted freely, second heater can be adjusted up and down,  and top and bottom temperature can control many groups and sections of temperature parameters at the same time. The third IR heater can be adjusted the power consumption.
4. Offer all kinds of hot-air nozzle, it can rotate 360°. With magnet, easy to install and change, customized is available. Bottom IR heater ensure an even heat for PCB board.
5. Choose imported high-precision K-type thermocouple, closed loop control and automatic temperature compensation system, combined PLC module for the precision control of temperature.
6. Use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB from deformation when heated or cooled, and it can rework for any BGA package size.
7. powerful cross-flow fan rapidly cool the PCB board to improve efficiency. Also built-in vacuum pump and external vacuum suction pen, pick up the chips rapidly.
8. After finishing desoldering & soldering, There is an alarming and alarming in advance.
9. With emergency stop and Automatic power-off protection device when abnormal accident happens. With a double over-heating protection control.
Specification:
Model
ZM-R5830
Total Power
4500W
Upside heater
800W
Downside heater
1200W
IR heater
2400W
Power supply
AC220V - 50/60Hz
dimension
535*650*600mm
Positioning
V-groove, PCB support can be adjusted in any direction with external universal fixture
Temperature control
(K Sensor) closed loop, independent heating, precision within 1 degree
PCB size
Max. 350*330mm Min. 20*20 mm
Electrical part
Highly sensitive temperature control module + 7'' Touch screen
Dimension
L535 * W650 * H650mm
Weight
35kg
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What in Package:
1  X   ZM-R5830 Hot Air BGA Rework Station
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