Stencils 3pcs Accessories Kit Module Plate Reballing Universal Practical

Description

Product Description
Stencils 3pcs Accessories Kit Module Plate Reballing Universal Practical
Details:
This 3 pieces BGA stencils tin plate was for samsung HUAWEI Android MTK series chip IC reballing repair.
High quality and brand new.
Package Contents:
1 * BGA Reballing Stencils for S5026 48 in 1 Samsung
1 * BGA Reballing Stencils for A418 samsung HTC HUAWEI android MTK
1 * BGA Reballing Stencils for A90 MTK Series
Note:
The real color of the item may be slightly different from the pictures shown on website caused by many factors such as brightness of your monitor and light brightness.
Payment
We accept payment via Paypal only.
Payment must be completed within 5 days. If you have any problems about payment, please contact us via ebay message.
Delivery details
We only
ship to confirmed Paypal addresses.
Please comfirm that your paypal address is in line with your shipping address.
Please kindly note that
the c
ombined shipping
is not provided
because the shipping fee is calculated by weight. Also, the each additional item means
exactly
the the same color and size.
It takes about
7
-15 working days to US; about 10-30 working days to other countries.
Transit time may be a little delayed because of the
bad
weather and customs
inspection
. If you
do
not receive your
item
within 30 working days since payment finished, please contact us immediately for further assistance.
Contact us
We strive for 100% customer satisfaction! Positive Feedback is very important to us. If you have any questions,
p
lease feel free to contact us via "Ask seller a question" . We will reply your email within 24
working hours.