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MECHANIC BGA Reballing Positioning Planting Platform For iPhone X - 11 Pro Max

$ 21.11

Availability: 100 in stock
  • Model Number: MECHANIC IBGA Reballing Positioning Planting Platform
  • Features 4: Integrated, removable tin planting
  • All returns accepted: Returns Accepted
  • Features 3: Strong magnetic automatic positioning
  • Return shipping will be paid by: Buyer
  • Refund will be given as: Money Back
  • Condition: New
  • MPN: Does Not Apply
  • Restocking Fee: No
  • Type: BGA Reballing Platform for iPhone
  • Features 5: Positioning slot of double-sided motherboard
  • item name: BGA Reballing Stencil Fixture
  • Size: 97*76*20mm
  • Features 1: Anti-leakage tin barrier design
  • Features 2: High temperature does not allow drum
  • Brand: sfder
  • Item must be returned within: 30 Days
  • Apply: for iPhoneX/Xs/XsMax/11/11pro/11pro max

    Description

    Store Categories
    Store Categories
    DC Power Supply
    Screwdriver & Screwdriver Set
    Tweezers / Tweezers suit
    Phone PCB Holder
    Storage Box
    Steel net /Plant tin station
    Repair insulation pad
    Clamp / Fixture / Fixing devic
    Opening Pry Tool / Repair Blad
    Soldering station & iron
    UV glue curing lamp / Light
    Motherboard Repair Tool
    Wire
    Other
    Product Description
    MECHANIC BGA Reballing Stencil Kit IBGA Max For IPhone X Xs Max 11 11Pro 11Pro Max Automatic Positioning Tin Planting Platform
    Description
    :
    MECHANIC iBGA Reballing Positioning Planting Platform For Iphone X XS MAX 11 pro max Repair, MECHANIC iBGA Max 6 in professional BGA Reballing Stencil Fixture for iPhone X/Xs/XsMax/11/11pro/11pro max, it is used for positioning and reballing iPhone PCB BGA parts, convenient and faster for reballing BGA without any damage, offer you best solution for iPhone BGA reballing and repairing.
    MECHANIC iBGA Max 6 in 1 Mid-level Automatic Positioning Tin Planting Platform
    Feature:
    Support with IPX / XS / XS MAX motherboard, RF small board IP11 / 11 PRO / 11 PRO MAX positioning tin replanting application
    1. Anti-leakage tin barrier design
    2. High temperature does not allow drum,
    3. Strong magnetic automatic positioning
    4. Integrated, removable tin planting,
    5. Positioning slot of double-sided motherboard
    Package:
    1*
    MECHANIC BGA Reballing Stencil Kit IBGA Max
    Payment Policy
    Shipping Policy
    About us
    Payment Policy
    We accept PayPal only.
    We only ship item to your PayPal verified address.
    Payment must be received within 3 days from the date of purchase.
    Orders will be processed instantly and dispatched in same day normally, so we do NOT accept any Email/Message note after you place orders.
    Shipping Policy
    We will post to your ebay address,so please make sure your ebay address was correct! if anything wrong,please contact me to correct it before package shipped.
    Note:
    The delivery time was for Reference only. The shipping might delay because of the Busy shipping, Holiday, Bad weather or force majeure etc.
    Our price dose not include taxes,VAT,or other hidden charges.  So as a buyer,it is your duty to pay the tax when you make an order from abroad.
    (most of time the customs won't charge taxes cause it was small package, but if you purchase a big package, please make sure your local customs policy before puchase,thanks).
    About us
    We are always striving to offer our customers high product quality, reasonable prices, excellent customer service and a reliable credit standing. If you like our products, please add my eBay shop to your"My Favorites" list.
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