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BGA Reballing Stencil Template Groove for iPhone A8 A9 A10 A11 A12 A13 Planting

BGA Reballing Stencil Template Groove for iPhone A8 A9 A10 A11 A12 A13 Planting

$ 10.02

Availability: 21 in stock
  • Return shipping will be paid by: Buyer
  • Size: 84mm*68mm
  • Model Number: Stainless Steel
  • All returns accepted: Returns Accepted
  • Combination: For iPhone 6 6P 6S 6SP 7 7 8 8P X XS XR XS-Max
  • Package: Bag
  • Refund will be given as: Money Back
  • Number of Pieces: 1 piece
  • Brand: Apple
  • Condition: New
  • Item must be returned within: 30 Days
  • MPN: Does not apply
  • Application: CPU BGA Reballing
  • Restocking Fee: No
  • DIY Supplies: Electrical

    Description

    HIgh Quality MJ 3D IC Chip BGA Reballing Stencil,Can
    location the IC chip when you repair, it's so convenient. Stable, and accurately. Don't need IC holder station
    Feature:
    1.Stepped groove design enables stencil to align with tinning position of IC rapidly.
    2.The square holes design makes it easier to take out the formed solder balls.
    3.This 3D stencil is easy to use no matter you are a new or expert.
    4.High success rate of planting tin,the solder balls can be formed once after you are proficient.
    5.This 3D planting stencil is thicker than ordinary stencils in the market .Less tendency of deformation makes its using life be longer.
    Some new products have blue protect film,Please remove it before you use it